Innovative digital AR/AI solutions resonated at PACK EXPO 2023
TAUNTON, Mass.–(BUSINESS WIRE)–#CEU–Harpak-ULMA®, the industry leader in smart, connected packaging solutions, was named a PMMI 2023 Technology Excellence Award winner for its “AI Enabled Augmented Reality for Transforming Packaging Operations” at PACK EXPO International 2023.
Harpak-ULMA has developed and deployed various AR solutions as part of its smart, connected machine strategy. Combining Artificial Intelligence (AI) capabilities with AR applications dramatically improves maintenance outcomes by enforcing and validating step-by-step guides and visual work instructions. The company’s beta deployment at multiple Fortune 50 producers has exceeded expectations, including one instance in which untrained staff completed a complex repair with 100% accuracy and 70% faster than an experienced technician.
“Leveraging Augmented Reality in a production environment immediately impacts frontline worker productivity. It’s much faster and more effective to offer staff ‘knowledge-on-demand’ versus traditional training and written instructions,” said Alexander Ouellet, Harpak-ULMAs Innovation Manager.
Responsible for executing the company’s multi-year, multi-phase technology strategy, Ouellet has found that “people prefer, and respond better, to visual guidance. It overcomes language barriers and shortens lengthy training cycles. Combining AR capabilities with AI provides additional guidance by enforcing and validating step-by-step processes in real time. ‘Currently, we’re only scratching the surface of the synergy between AI and AR technologies. I believe our technology approach and results resonated with the audience — evidenced by our award for excellence.”
Harpak-ULMA is developing various innovative technologies that support the digital transformation of packaging operations, including remote [OEE] monitoring, digital twins of their machines, and, eventually, predictive capabilities that leverage AI and machine learning to minimize unplanned downtime.
PMMI Technology Excellence Awards recognize innovations in packaging and processing and are bestowed, based on attendee voting, at PACK EXPO, the world’s largest packaging and processing show. Harpak-ULMA won its award in the General Packaging and Processing category. PMMI, The Association for Packaging and Processing Technologies, produces the awards and PACK EXPO.
For more information about Harpak-ULMA® and how AR combined with AI can transform your manufacturing processes, please visit https://www.harpak-ulma.com/ar-packaging/, or experience a live demonstration at one of Harpak-ULMA’s Customer Experience Centers in Boston, Atlanta and now also in Costa Mesa, Calif. Call (508) 884-2500 to make arrangements.
Visit Harpak-ULMA at Process Expo, booth 2126, in McCormick Place, Chicago, October 23-24, 2023.
Harpak-ULMA is the North American arm of ULMA, a $1B industry leader in complete packaging line solutions for Food, Medical, Bakery, and Industrial products. Harpak-ULMA provides smart, connected packaging systems utilizing Rockwell Automation’s controls and information platforms to deliver greater efficiency, uptime, and throughput, as well as better package quality and reduced waste. Well-designed, reliable solutions reduce customers’ total cost of ownership, help them overcome the challenges of an aging and evolving workforce, and improve control of maintenance expenses with competitive parts sourcing. In addition to offering ULMA primary packaging systems and comprehensive automation solutions, Harpak-ULMA is the exclusive North American distributor of G. Mondini tray sealers. Harpak-ULMA joined the Rockwell Automation Partner Network in 2018 as part of its initiative to build and deploy smart, connected packaging solutions.