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Global 3D Mobile Sensing Hardware Market Will Reach USD 322.90 Billion by 2024: Zion Market Research

(July 10, 2018)

According to the report, the global 3D Mobile Sensing Hardware Market was valued at USD 1.38 billion in 2017 and is expected to reach USD 322.90 billion globally by 2024, growing at a CAGR of around 118% between 2018 and 2024.

New York, NY, July 10, 2018 (GLOBE NEWSWIRE) -- Zion Market Research has published a new report titled “3D Mobile Sensing Hardware Market by Type (External sensors and Built-in (Embedded and Internal)), by Product (MEMS, Pressure sensors, Microphones, and Environmental sensors), by Application (Consumer Electronics, Security & Surveillance, Healthcare, Entertainment, Aerospace & Defense, Automotive, Industrial Robotics, and Others): Global Industry Perspective, Comprehensive Analysis and Forecast, 2017– 2024”. According to the report, the global 3D Mobile Sensing Hardware Market was valued at USD 1.38 billion in 2017 and is expected to reach USD 322.90 billion globally by 2024, growing at a CAGR of around 118% between 2018 and 2024.

There has been an increasing application of sensor mobile phones or 3D mobile sensing systems and tablets across the globe. Sensors and MEMS are very important and popular component that enables many new features on mobile phones and tablets. Based on design and communication features, all mobile phone sensors are segmented into external sensors and built-in (embedded and internal). In 3D mobile sensing hardware market, 3D cameras anticipate being a game-changer in the forecast period.

Browse through 42 Tables & 36 Figures spread over 110 Pages and in-depth TOC on "Global 3D Mobile Sensing Hardware Market: Industry Size, Trends, Applications, Analysis and Forecast, 2017– 2024”.



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The rising adoption of pressure sensors among consumers and the increasing sales of smartphones and tablets have accelerated the development of the global 3D mobile sensing hardware market. The booming Chinese smartphone markets and acceleration in the adoption of the internet of things (IoT) are also some of the factors propelling the growth of this market. Also, the rapid technological advancements are opening up a plethora of new applications across different industry verticals where 3D mobile sensing hardware can be used. Moreover, the focus on new product developments such as infra-red (IR) or multispectral imaging and gas sensors offers a potential opportunity to the market. However, the limitation in the adoption of 3D sensing technology and risk of commoditization is anticipated to hamper the demand for the market. Furthermore, the momentum of the market growth for 3D mobile sensing hardware will depend on component suppliers and smartphone makers. In addition, the development of third-party applications will be influential in raising the overall growth ratio of 3D mobile sensing hardware market.

The global 3D mobile sensing hardware market is segmented on the basis of type, product, application, and regions. The type segment for 3D mobile sensing hardware market is bifurcated into external sensors and built-in (embedded and internal). Microphones, MEMS (microelectromechanical system) inertial sensors, pressure sensors, ALS (ambient light sensing), environmental sensors, fingerprint, and CMOS are some of the products of global 3D mobile sensing hardware market. The verticals of 3D mobile sensing hardware market are categorized into aerospace & defense, consumer electronics, security & surveillance, entertainment, healthcare, automotive, industrial robotics, and others.

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The regional analysis of 3D mobile sensing hardware market is divided into regions such as North America, Asia Pacific, Europe, Latin America, and Rest of the World. Among these, North America holds the largest market share of 3D mobile sensing hardware market due to its rising adoption rate in smart electronic devices technology. North America and Europe both are likely to observe strong growth opportunities during upcoming years owing to rising investments in the mobile phones manufacturing industry.

Asia Pacific region is anticipated to hold high growth rate during the forecast period due to the strong players in countries such as China, Taiwan, South Korea, and Japan. The increasing adoption rate of 3D mobile sensors in industrial robotics, healthcare, and entertainment sectors serves for the market development in this region. In addition, the 3D sensing feature on smartphone mainly used for facial recognition of the user, such as unlocking the device and mobile payment is another factor enhancing the demand for the 3D mobile sensing hardware in the Asia Pacific region.

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Some of the key players in the 3D mobile sensing hardware market are TrendForce Corporation, Infineon Technologies, PMD Technologies, Qualcomm Technologies, Inc., Himax Technologies, Inc., AMS AG, Sunny Opotech Co., Ltd., Heptagon, Lumentum Operations LLC, Microsoft Corporation, Google LLC, Lenovo, Apple Inc., among others.

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The report segments the global 3D mobile sensing hardware market as follows:

Global 3D Mobile Sensing Hardware Market: By Type

  • External sensors
  • Built-in (Embedded, Internal) 

Global 3D Mobile Sensing Hardware Market: By Product

  • MEMS (Microelectromechanical System) 
  • Pressure Sensors
  • Microphones
  • Environmental Sensors
  • Fingerprint
  • ALS (Ambient Light Sensing)
  • CMOS
  • Others

Global 3D Mobile Sensing Hardware Market: By Application

  • Consumer Electronics
  • Security &Surveillance
  • Healthcare, Entertainment
  • Aerospace &Defense
  • Automotive
  • Industrial Robotics 
  • Others

Global 3D Mobile Sensing Hardware Market: By Region

  • North America
    • The U.S.
  • Europe
    • UK
    • France
    • Germany
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • The Middle East and Africa

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